TC for these components is chosen experimentally based on publicly available information. An exception is made for the power resistors and connectors (J1, J2). 3 and for 5W on Fig.4.īased on input CAD data, the user can set up and analyze several cases with different complexity of the PCB components (as shown in Fig.3).įor this comparison, the shapes of components are auto-generated by CST Studio Suite to create a simplified version for models A, B and C with one exception in model A, where power resistors are directly imported from CAD database.Ĭomponents are characterized by a default material, automatically assigned by the workflow, with a thermal conductivity (TC) of 5W/K/m. The models specified for a load 1.5W are shown on Fig. The thermal simulations are performed for two different electrical loading conditions: 1.5 and 5 watts (W). Nowadays, almost all of that information is already stored inside files generated by well-known EDA tools.įig.

E-, M-CAD models, PCB layout with its stack-up and schematics, PCB component shapes, and so on). Firstly, a user collects all necessary data (e.g. Where necessary, AC losses can also be added to the simulation through 3D co-simulation.Īs shown in Fig.1, the simulation process is relatively simple. Moreover, CHT analysis removes the need for the user to set thermal surfaces in the model.

2-resistor) for each and every single one of the components soldered on the PCB. With this approach a user saves a lot of time during model setup, because the workflow does not require a user to manually search and define equivalent thermal models (e.g. Thermal simulation is run with the CST Studio Suite conjugate heat transfer solver (CHT) as it is the best suited for the job. heat sources, thermal losses of a PCB, geometry of the PCB components).

In order to keep the model preparation stage as simple as possible, all necessary data needed to engage a thermal simulation is obtained from an IR-Drop analysis (e.g. This analysis considers a PCB without any enclosure. The simulation results will also be verified against measurements. This document will demonstrate a fast, efficient workflow for PCB thermal simulation in CST Studio Suite using IR-Drop analysis and show the advantages of this approach. Thermal simulation can reveal the temperature distribution on a PCB before manufacturing a physical prototype.

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